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Core Product Value

The Clean-Type Oven focuses on three core scenarios: Post-Development, Post-Etching, and Post-Ultrasonic Cleaning Drying. With three technical advantages—Dust-Free Environment, Precise Temperature Control, and Flexible Batch Processing—it addresses the pain points in the midstream of PCB production: "short circuits, oxidation, and poor interlayer bonding caused by residual moisture/impurities after cleaning":

Dust-Free Environment Guarantee: Built-in air purification system ensures Class 100 cleanliness in the working area, preventing secondary contamination of PCB boards by dust.
Precise Temperature Control & Uniform Drying: Accurate temperature control at 60-80℃ with ±1℃ uniformity, ensuring thorough and even evaporation of moisture on the PCB surface without local residue.
Multi-Batch & Small-Batch Adaptation: Flexible loading methods and process parameter storage perfectly match the multi-variety, small-batch PCB production mode.

Core Technical Features

Class 100 Cleanliness System

Equipped with a HEPA high-efficiency filter (H14 class) and positive-pressure airflow design, the working area achieves Class 100 (ISO Class 5) cleanliness, eliminating dust and particle contamination on PCB boards.

Precise Temperature Control & Uniformity

PID intelligent temperature control + multi-point temperature monitoring, with a temperature range of 60-80℃ and temperature uniformity of ±1℃, ensuring even evaporation of moisture on the PCB surface without residual watermarks.

Clean Hot Air Circulation

Corrosion-resistant centrifugal fan + high-efficiency airflow distribution plate enable 360° dead-angle-free clean hot air circulation, increasing drying efficiency by 30% and avoiding scratches on the PCB surface.

Intelligent Process Storage

7-inch touchscreen + PLC system supports storage of 20 process curves, adapting to the drying needs of PCB boards with different thicknesses and materials, and increasing switching efficiency by 50%.

Flexible Loading Design

Adjustable shelves + anti-static trays support batch loading of single-sided, double-sided, and multi-layer PCBs. Single-batch processing capacity ranges from 100 to 500 pieces (depending on model).

Rapid Dehumidification System

Built-in dual-system of condensation dehumidification + silica gel adsorption quickly reduces the humidity in the working chamber (≤5%RH), shortening drying time and improving production line efficiency.

Technical Parameters & Performance

Core Parameters

Applicable Process Post-Development/Post-Etching/Post-Ultrasonic Cleaning Drying

Temperature Range 60-80℃

Temperature Uniformity ±1℃

Cleanliness Class Class 100 (ISO Class 5)

Filter System：HEPA H14 Class High-Efficiency Filter

Dehumidification System：Dual-System (Condensation + Silica Gel Adsorption)

Working Chamber Size (Optional)

? 500×500×500mm
? 600×600×600mm
? 800×800×800mm
? Custom Size

Single-Batch Processing Capacity

? Small Model：100-200 Pieces
? Medium Model：200-300 Pieces
? Large Model：300-500 Pieces

Temperature Uniformity & Cleanliness Test

Temperature Uniformity at 70℃ (30-Min Monitoring)

Cleanliness Test Result

Under static working conditions, the number of particles ≥0.5μm in the working area is ≤100 particles/ft3, meeting the Class 100 (ISO Class 5) cleanliness standard and satisfying the drying needs of high-end PCB products.

Application Scenarios & Processes

Core Application Scenario Processes

Post-Development Drying Process

After PCB development, residual developer and moisture remain on the surface. If not thoroughly dried, it may cause uneven etching and circuit short circuits in subsequent processes. The Clean-Type Oven uses precise temperature control at 60-70℃ and a dust-free environment to quickly evaporate residual liquids, ensuring circuit clarity.

1 Preheating：Room Temp → 60℃, 3℃/min, 10min Heat Preservation (Initial Evaporation of Free Water)
2 Main Drying：60℃ → 70℃, 2℃/min, 20min Heat Preservation (Complete Evaporation of Developer and Bound Water)
3 Cooling：70℃ → 40℃, Natural Cooling (Avoid Thermal Stress)

Post-Ultrasonic Cleaning Drying Process

After ultrasonic cleaning of PCBs, residual moisture in microholes and on the surface, if not completely removed, can cause oxidation and coating blistering in subsequent processes. The Clean-Type Oven achieves complete evaporation of moisture in microholes and on the surface through high temperature (70-80℃) and strong dehumidification.

1 Preheating：Room Temp → 70℃, 4℃/min, 10min Heat Preservation (Activate Dehumidification System)
2 Main Drying：70℃ → 80℃, 2℃/min, 30min Heat Preservation (Deep Evaporation of Moisture in Microholes)
3 Dehumidification & Cooling：80℃ → 40℃, Activate Strong Dehumidification, Cool After 10min Heat Preservation

Other Extended Scenarios

Post-Etching Drying

After etching, residual etchant and moisture remain on the PCB surface. Clean drying at 60-70℃ prevents copper surface oxidation and circuit corrosion caused by residual liquids.

Solder Mask Ink Pre-Drying

After solder mask ink printing, pre-drying at 60℃ in a clean environment can initially cure the ink, preventing ink flow and adhesion in subsequent processes.

FPC Flexible Board Drying

Flexible FPC boards are sensitive to materials. Gentle drying at 60℃ in a dust-free environment prevents board deformation and surface contamination.

Successful Application Cases

PCB

Continuous Drying Solution for Precision PCB Manufacturers

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosPrecision Tunnel-Type Continuous Drying Line3 linesTemperature Control Range: 50~200℃ (Accuracy ±0.3℃); Conveying Speed: 0.2~1.5m/min (frequency-variable adjustable); Drying

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PCB

PCB Material Curing Solution

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosMulti-layer Board Lamination & Curing Machine4 unitsTemperature Control Range: Room Temperature ~ 220℃ (Accuracy ±0.5℃); Lamination Pressure: 0.5~5MPa (Adjustable); Heati