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Front View of Standard Hot Air Circulation Oven

Core Product Value

The Standard Hot Air Circulation Oven focuses on two core scenarios: PTH (Plated Through-Hole) Pretreatment and Post-Electroplating Drying. With three technical advantages—Uniform Drying via Hot Air Circulation, 24/7 Continuous Operation, and Deep Drying in Holes—it addresses the pain points in the midstream of PCB production: "moisture residue after PTH/electroplating causing hole defects, production line downtime, and poor coating adhesion":

Uniformity of Hot Air Circulation: Forced hot air circulation system ensures ±1℃ temperature uniformity within 70-90℃, enabling simultaneous and uniform evaporation of moisture on the PCB surface and inside holes.
24/7 Continuous Operation: Industrial-grade stable design supports round-the-clock uninterrupted production, matching the continuous rhythm of large-scale PCB lines and improving overall capacity.
Thorough Drying in Holes: Optimized airflow path and wind speed design penetrate microholes and blind holes of PCBs, achieving complete evaporation of moisture inside holes and avoiding defects like PTH voids and coating blistering.

Core Technical Features

Forced Hot Air Circulation System

High-power centrifugal fan + deflector design creates a 360° circulating hot air field. Temperature uniformity is ±1℃, ensuring simultaneous evaporation of moisture on the PCB surface and inside holes without local residue.

24/7 Continuous Operation

Industrial-grade components and heat dissipation design support round-the-clock uninterrupted production. Mean Time Between Failures (MTBF) exceeds 10,000 hours, matching the rhythm of large-scale production lines.

Intelligent Temperature Control & Process Storage

PID intelligent temperature control + 7-inch touchscreen supports storage of 10 process curves. Optimal drying parameters can be quickly recalled based on PCB moisture content after PTH or electroplating.

Efficient Dehumidification System

Built-in condensation dehumidification + exhaust linkage quickly reduces working chamber humidity (≤10%RH), shortening drying time. It takes only 15-30 minutes (depending on process) for PCBs to go from "wet" to "completely dry".

Flexible Loading & Adaptation

Adjustable shelves + anti-static trays support batch loading of single-sided, double-sided, and multi-layer PCBs. Single-batch processing capacity ranges from 200 to 800 pieces (depending on model).

Industrial-Grade Durability

The outer shell is made of cold-rolled steel with plastic coating, and the inner chamber is made of SUS304 stainless steel. Key components (fans, heaters) use international brands to ensure long-term stable operation.

Technical Parameters & Performance

Core Parameters

Applicable Process PTH Pretreatment, Post-Electroplating Drying

Temperature Range 70-90℃

Temperature Uniformity ±1℃

Heating Method Hot Air Circulation Heating

Operation Capacity：24/7 Continuous Operation

Dehumidification Capacity：≤10%RH Working Chamber Humidity

Working Chamber Size (Optional)

? 600×600×600mm
? 800×800×800mm
? 1000×1000×1000mm
? Custom Size

Single-Batch Processing Capacity

? Small Model：200-300 Pieces
? Medium Model：300-500 Pieces
? Large Model：500-800 Pieces

Inner-Hole Drying Effect Test

Moisture Content Change in PCB Holes at 80℃ (30-Min Monitoring)

Test Conclusion

At 80℃ under hot air circulation, the initial moisture content inside PCB holes was 15%, and it dropped to below 0.5% after 30 minutes. This meets the strict requirement of "complete inner-hole drying" for PTH and electroplating processes, effectively avoiding defects such as hole-wall voids and poor coating adhesion.

Application Scenarios & Processes

Core Application Scenario Processes

PTH Pretreatment Drying

After PTH pretreatment (desmear, activation), residual moisture inside holes and on the surface will cause PTH layer voids and poor adhesion. The standard oven achieves complete evaporation of inner-hole moisture through 70-80℃ hot air circulation + strong dehumidification, providing a "dry and clean" substrate for the PTH process.

1 Preheating：Room Temp → 60℃, 5℃/min, 10min Heat Preservation (Activate Dehumidification System)
2 Main Drying：60℃ → 80℃, 3℃/min, 20min Heat Preservation (Deep Evaporation of Inner-Hole Moisture)
3 Dehumidification & Preservation：80℃, Activate Strong Dehumidification, 10min Heat Preservation (Ensure Inner-Hole Dryness ≤0.5%)

Post-Electroplating Drying

After PCB electroplating (e.g., copper plating, tin plating), residual electroplating solution and moisture remain on the surface and inside holes. If not thoroughly dried, it will cause coating oxidation, pinholes, and blistering. The standard oven uses 80-90℃ high-temperature hot air to quickly evaporate residual liquids, while the uniformity of hot air circulation avoids coating discoloration due to local overheating.

1 Preheating：Room Temp → 70℃, 4℃/min, 10min Heat Preservation (Initial Evaporation of Free Water)
2 Main Drying：70℃ → 90℃, 3℃/min, 20min Heat Preservation (Complete Evaporation of Electroplating Solution & Bound Water)
3 Cooling：90℃ → 50℃, Natural Cooling (Avoid Coating Thermal Stress)

Extended Application Scenarios

Post-ENIG Drying

After Electroless Nickel Immersion Gold (ENIG) processing, residual chemicals remain on the PCB surface. Drying at 70-80℃ prevents oxidation and discoloration of the nickel-gold layer, improving surface flatness and solderability.

OSP Coating Curing

After OSP (Organic Solderability Preservative) coating, drying at around 80℃ accelerates coating curing, improving the corrosion resistance and high-temperature stability of the OSP film.

Post-Washing Drying for FPC

After FPC (Flexible PCB) washing, gentle low-temperature drying (around 70℃) + hot air circulation prevents board deformation while thoroughly removing moisture to avoid circuit corrosion.

Successful Application Cases

PCB

Continuous Drying Solution for Precision PCB Manufacturers

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosPrecision Tunnel-Type Continuous Drying Line3 linesTemperature Control Range: 50~200℃ (Accuracy ±0.3℃); Conveying Speed: 0.2~1.5m/min (frequency-variable adjustable); Drying

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PCB

PCB Material Curing Solution

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosMulti-layer Board Lamination & Curing Machine4 unitsTemperature Control Range: Room Temperature ~ 220℃ (Accuracy ±0.5℃); Lamination Pressure: 0.5~5MPa (Adjustable); Heati