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Front View of Corrosion-Resistant High-Temperature Oven

Core Product Value

The Corrosion-Resistant High-Temperature Oven focuses on two core scenarios: Chemical Raw Material Drying and Catalyst Regeneration. With three technical advantages—Full Corrosion-Resistant Materials, Wide Temperature Range Control, and High-Power Exhaust System—it addresses the pain points of "short equipment life, poor temperature control precision, and difficult waste gas discharge" in the upstream of the PCB industry under strong corrosion environments:

Full Corrosion-Resistant Structure: The inner chamber and key components are made of SUS304/SUS316 stainless steel, resistant to acids, alkalis, and corrosion, adapting to harsh working conditions with strongly corrosive chemicals/catalysts.
Wide Temperature Range & Precise Control: Supports a temperature range of room temperature to 300℃ (up to 500℃ for special customization) with a temperature uniformity of ±2-5℃, meeting the drying needs of different raw materials/catalysts.
High-Power Exhaust System: Equipped with a corrosion-resistant high-power exhaust device, efficiently discharging corrosive gases generated during drying to ensure equipment life and production safety.

Core Technical Features

Full Corrosion-Resistant Material System

The inner chamber is made of SUS304/SUS316 stainless steel (special alloy optional) with a passivated surface. Key connectors and seals are made of corrosion-resistant materials, providing excellent overall acid, alkali, and corrosion resistance.

Wide Temperature Range & Precise Control

Dual-zone heating + intelligent PID temperature control supports a standard temperature range of room temperature to 300℃ (up to 500℃ for special customization). Temperature uniformity is controlled within ±2-5℃, matching the drying/regeneration temperature requirements of different chemical raw materials and catalysts.

Corrosion-Resistant High-Power Exhaust System

Corrosion-resistant centrifugal fan + acid-alkali resistant air duct with adjustable exhaust rate (200-1000m3/h). Efficiently discharges corrosive gases to reduce internal equipment corrosion risks and ensure production safety.

Intelligent Corrosion-Resistant Control

7-inch touchscreen + PLC system supports storage of 50 process curves. Corrosion-resistant sensors monitor temperature and gas concentration in real time, with fault self-diagnosis and corrosion prevention early warning functions.

Multiple Safety Designs

Equipped with corrosion-resistant sealing, explosion-proof (optional), and over-temperature protection devices. Gas concentration monitoring links with exhaust systems to reduce corrosion and safety risks from the source.

Customization Adaptation

Supports customization of working chamber size, material (SUS304/SUS316/special alloy), and maximum temperature (300℃/500℃) to match special process requirements.

Technical Parameters & Performance

Core Parameters

Applicable Process Chemical Raw Material Drying, Catalyst Regeneration

Temperature Range Room Temperature - 300℃ (Special 500℃)

Temperature Uniformity ±2-5℃

Heating Rate 1-15℃/min (Adjustable)

Inner Chamber Material：SUS304/SUS316 Stainless Steel (Special Alloy Optional)

Exhaust System：Corrosion-Resistant High-Power Exhaust (200-1000m3/h Adjustable)

Working Chamber Size (Optional)

? 400×400×400mm
? 500×500×500mm
? 600×600×600mm
? 800×800×800mm
? Custom Size

Power Supply Requirements

? AC 380V 50Hz
? Power：8-20kW (Depends on Model/Temperature)
? Protection Class：IP54

Temperature Uniformity Test (300℃ Working Condition)

Test Conditions

? Test Temperature：300℃ (Typical Drying Temp for Chemical Raw Materials)
? Test Points：9 Uniformly Distributed Points in Working Chamber
? Test Duration：Continuous Recording for 30 Minutes After Temperature Stabilization
? Environment：25℃, 50%RH Humidity

Application Scenarios & Processes

Core Process for Chemical Raw Material Drying

In PCB chemical production, the corrosion-resistant high-temperature oven is used for chemical raw material drying: Under strong corrosion environments (acidic/alkaline chemicals), it precisely controls the drying temperature (room temperature-300℃) to efficiently remove moisture/solvents from raw materials. Meanwhile, the high-power exhaust system discharges corrosive gases, providing pure, dry raw materials for high-quality PCB chemicals.

Typical Chemical Drying Process Curve

1 Preheating：Room Temp → 100℃, 5℃/min, 30min Heat Preservation (Free Water Removal)
2 Drying：100℃ → 200℃, 3℃/min, 120min Heat Preservation (Bound Water/Solvent Removal)
3 High-Temperature：200℃ → 300℃, 2℃/min, 60min Heat Preservation (Deep Drying/Activation)
4 Cooling：300℃ → 60℃, Natural Cooling (Avoid Thermal Shock)

Catalyst Regeneration Scenarios

PCB Electroplating Catalyst Regeneration

Used for 500℃ high-temperature regeneration of deactivated PCB electroplating catalysts (e.g., palladium catalysts). High-temperature roasting removes impurities and carbon deposits to restore catalytic activity.

Etchant Catalyst Regeneration

Targets precious metal catalysts (gold, platinum) in PCB etchants. Precise temperature-controlled drying and activation enable cyclic reuse of catalysts, reducing costs by over 30%.

Special Resin Catalyst Activation

Used for high-temperature activation of catalysts in PCB special resin synthesis. Drying and roasting within specific temperature ranges improve catalytic activity and resin synthesis efficiency.

Successful Application Cases

PCB

Continuous Drying Solution for Precision PCB Manufacturers

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosPrecision Tunnel-Type Continuous Drying Line3 linesTemperature Control Range: 50~200℃ (Accuracy ±0.3℃); Conveying Speed: 0.2~1.5m/min (frequency-variable adjustable); Drying

View case details

PCB

PCB Material Curing Solution

1. Core Equipment Configuration and Technical ParametersEquipment TypeQuantityKey Technical ParametersApplication ScenariosMulti-layer Board Lamination & Curing Machine4 unitsTemperature Control Range: Room Temperature ~ 220℃ (Accuracy ±0.5℃); Lamination Pressure: 0.5~5MPa (Adjustable); Heati